Flexible FPC Material Contact Chip Card 1.0mm Thickness IP68 Waterproof
Contact chip embedded smart card thickness 1.0mm screen printing layout customization
Product introduction: Heyang technology's financial visual card (digital currency Hard Wallet) adopts self-developed glue and cold pressing technology to customize the card thickness at 0.84-3.0mm. According to customer needs, PCB, visual screen, thin battery, LED lamp, Bluetooth ibeacon module, fingerprint module, blockchain, switch and other components can be embedded in the card for packaging, The product can adopt the low-power built-in lithium battery scheme to realize multi-mode selection such as solar charging, wireless charging or magnetic absorption charging.
| Product parameters |
Type |
Active / passive |
| Screen |
Electronic Paper / Glass / OLED screen |
| Screen size |
1.02 inch / 1.54 inch Section screen / dot screen |
| Appearance color |
Customizable layout |
| Thumbprint module |
IDEX/FPC |
| Beacon tips |
Led prompt light (Color customizable) |
| Interface |
7816 interface (optional) |
| RFID |
13.56mhz |
| NFC |
Optional |
| Bluetooth |
Optional |
| Waterproof grade |
IP68 industrial waterproof |
| Number of keys |
1 bits / 2 bits(Customizable) |
| Ultra thin lithium battery |
>80mah (as required) |
| Charging mode |
Magnetic suction / wireless charging / solar charging |
PCBA card sealing process: packaging PCBA into smart card has been a technical difficulty in the smart card industry for many years. The high-temperature melting PVC method used in the traditional smart card manufacturing process can no longer meet the PCBA circuit board business card printing. The high temperature of the traditional process will lead to problems such as lithium battery failure and component damage. Heyang technology began to establish a special scientific research team in 2014, Tackling the PCBA card sealing technology, through continuous research, we have developed the relevant technologies and equipment for PCBA card sealing and the corresponding glue formula. Using the PCBA card sealing technology achievements of Heyang for many years, we have successfully encapsulated the ultra-thin lithium battery, chip, solar panel, fingerprint, ink screen and other components or modules with high performance, high reliability and flat appearance at room temperature The daily production capacity of high-end smart cards that meet the bending test standards has reached 20000-30000 PCs. with the continuous efforts of Heyang, the production capacity, process and performance have been gradually improved and improved.
FAQ:Contact chip embedded smart card thickness 1.0mm screen printing layout customization
1. Q: Are you a factory or trading company?
A:We are a factory.
2. Q: Where is your factory located? How can I visit there?
A: Our factory is located in shenzhen, guangdong Province, China. All our clients, from home or abroad, are warmly welcome to visit us!
3. Q: Can we costomize the size, color, logo and package of the product?
A: Yes, all of these can be cusomized according to your needs.
4. Q: How about your quality control?
A: Our company has obtained CB ROHS certification.
5. Q: What is your MOQ?
A: Any quantity is acceptable for your order. And the price is negotiable for large quantity.
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